WU, Chun-Yi; CHEN, Chao-Chien; CHIN, Hui-Hsin. AI-Enabled Workflow Redesign for EECP Microcirculation Follow-Up: A Design Science Approach. EAI Endorsed Transactions on Internet of Things, [S. l.], v. 11, 2026. DOI: 10.4108/eetiot.12481. Disponível em: https://publications.eai.eu/index.php/IoT/article/view/12481. Acesso em: 20 may. 2026.