Wu, Chun-Yi, Chao-Chien Chen, and Hui-Hsin Chin. “AI-Enabled Workflow Redesign for EECP Microcirculation Follow-Up: A Design Science Approach”. EAI Endorsed Transactions on Internet of Things 11 (May 19, 2026). Accessed May 20, 2026. https://publications.eai.eu/index.php/IoT/article/view/12481.