Mixing of Join Point Interfaces and Feature-Oriented Programming for Modular Software Product Line

Authors

  • Cristian Vidal Universidad de Playa Ancha
  • David Benavides University of Seville image/svg+xml
  • Paul Leger Universidad Católica del Norte image/svg+xml
  • José Galindo French Institute for Research in Computer Science and Automation image/svg+xml
  • Hiroaki Fukuda Shibaura Institute of Technology image/svg+xml

DOI:

https://doi.org/10.4108/eai.3-12-2015.2262534

Keywords:

fop, classic aop, jpi, spl, modular software, jpi-fm

Abstract

Feature-oriented programming (FOP) and aspect-oriented programming (AOP) focus are to modularize additional classes behavior and crosscutting concerns, respectively, for soft- ware evolution. So, these software development approaches represent advanced paradigms for modular software product lines development. Thereby, a FOP and AOP symbiosis would permit reaching pros and cons of both approaches. FOP allows developers to modularly refine classes collaboration for Software Product Lines (SPLs), an adequate approach to represent heterogeneous crosscutting concerns. Similarly, traditional AOP structurally modularizes in a re- fined manner homogeneous crosscutting concerns. Since traditional AOP presents implicit dependencies and strong coupling between classes and aspects, these AOP issues are solved by the Join Point Interface JPI approach. This article presents JPI Feature Modules for FOP + JPI SPL components modularization, i.e., classes, aspects, and join point interfaces along with their evolution, for a SPL transparent implementation in a FOP + JPI context. In addition, this article shows JPI Feature Modules of a case study to highlight mutual benefits of FOP and JPI approaches for a modular SPL software conception.

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Published

24-05-2016

How to Cite

1.
Vidal C, Benavides D, Leger P, Galindo J, Fukuda H. Mixing of Join Point Interfaces and Feature-Oriented Programming for Modular Software Product Line. EAI Endorsed Scal Inf Syst [Internet]. 2016 May 24 [cited 2024 Jul. 3];3(10):e2. Available from: https://publications.eai.eu/index.php/sis/article/view/2255